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The QC-TT is the latest defect metrology system. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring buried defects to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, including 90nm and below, which reduces cycle times and facilitates fab expansion. This system provides the most comprehensive crystallographic defect inspection solution for analyzing wafer quality in incoming wafers and during metallization steps.