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High Temperature Cure Ovens

YES-450PB Series
YES 6-2P-CP (150 mm wafers)
YES 8-2P-CP (200 mm wafers)
YES 12-2P-CP (300 mm wafers)


YES ovens are designed to provide a controlled ramp curing process for temperatures up to 450ºC in an oxygen-free environment. In addition, YES ovens provide a cleaner process in a controlled environment, so you get higher yields. YES ovens offer a unique cooling package to reduce your process time and utilize laminar flow technology, so your wafers stay clean.

Applications:

  • Low-K dielectric cure
  • Polyimide bake
  • BCB cure
  • Copper anneal

For an automated high temperature vacuum processing system, please ask about the YES-PBV300.