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Semiconductor Package Failure Analysis
voids . disbonds . cracks . delamination . internal defects
The SCANNING ACOUSTIC MICROSCOPY VUE400-P is for Semiconductor Device Integrity Assessment and Failure Analysis and incorporates the latest in transducer and signal processing.
The OKOS Digital Imaging Software (ODIS) is a full featured imaging software with data acquisition, motion control, pulser receiver and imaging sub-systems. Its unique stream-to-disk functionality allows bypassing computer memory limitations.