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In the continued quest for miniaturization, thermal conductivity is playing an even more important role in today’s products. More and more adhesives are relied upon to dissipate generated heat away from active components.
EPO-TEK® products are unparalleled in their performance in effectively removing heat, providing increased dielectric strength and protecting circuits from hostile environments.
The epoxy adhesive properties can range from rigid (providing robust, thermally enhanced circuit protection) to flexible (ideal for substrates with significant CTE mismatches).
Heat-sink bonding, die attach, potting and glob-tops are just a few applications.
Please contact us further information.