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ARC-lite

ARC-lite is the world's first system to offer fast, reliable, room temperature AR coatings on package and wafer level devices. ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The sample produced are optimized and require no baking.

ARC-lite reaches maximum functionality when used with the ASAP-1 Selected Area Preparation System -- The ARC-lite sample mounting plate can be conveniently transferred between ARC-lite and ASAP-1.

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nRad R&D Slot Die Coating System

nTact’s proprietary slot die coating technology delivered in a small footprint, affordable platform geared to the R&D and pre-production market. The standard package is designed for the processing of 150 and/or 200mm square substrate sizes with a variety of optional features available for other applications.

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VertaCure Series

The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most demanding MEMS and semiconductor process applications. Whether it’s for proper curing of multiple layers of polyimide in an RDL (Bond Pad Re-routing) application or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

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