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Manual and automated gauges for control of wafer thickness and geometry

Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.

The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.

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Probe Refresher TPR-03

  • suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
  • cleaning/reshaping for vertical probe cards optional
  • reshaping method based on specifically formulated abrasive elastomer pad
  • highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
  • very good contact resistance after reshaping
  • maintains probecard alignment integrity, no realignment due to reshaping process necessary
  • fully automatic, no specific operator skills required
  • short p
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T.I.P.S

T.I.P.S. mission statement which emphasize on technical innovation, applied physics and electronics gives our customer confidence beeing state of art in measurement technology.

T.I.P.S. is your “one-stop-shop” for semiconductor measurement devices and microchip test interfaces. Based on revolutionary technologies and technical expertise and short manufacturing and maintenance lead time, T.I.P.S. provides full ownership of high yielding microchip test hardware.

http://www.tips.co.at/

 

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VLSI Standards, Inc.

VLSI Standards, Inc. was founded in 1984 in Mountain View, California for the purpose of developing measurement standards and associated services for the semiconductor and metrology related industries. VLSI Standards' first products were a NIST traceable Step Height Standard, and a line of Contamination Standards. Today, in our class I fabrication facility, along with offices in the US and Japan, VLSI Standards provides dozens of standards, products, and services to address every aspect of instrument calibration in the semiconductor and other industries requiring precise metrology.

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SELA Solutions EnabLing nano Analysis Ltd.

SELA develops and adapts technologies to provide roadmap solutions for physical failure analysis and characterization.

SELA offers a modular suite of tools for cost-effective material and root-cause failure analysis as from 1991.

SELA’s products incorporate unique technologies and IPs that solve bottlenecks in the failure analysis and sample preparation for wide variety of requirements.

www.sela.com

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BOIN GmbH

Founded in August 1998, Boin GmbH develops software solutions for the semiconductor industry and provides services such as the development of complex mathematical algorithms. The company was started based on a business plan which won 2nd prize in a business plan competition known as "StartUp". This is a nation-wide competiton of business plans initiated by the german magazine "Stern", the banking association Sparkasse, and the consultants McKinsey & Company.
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