Topography and Deformation Measurement (TDM)

TDM is a patented Insidix technology that helps the engineers to increase reliability
of their products from complex packaging and allows Failure Analysis engineers to
understand the root causes of failure observed in operations. The TDM operating
system combines a powerful, internally developed heating/cooling sequence with a
sophisticated optical set up for 3D topography analysis under thermal stress of all
kinds of materials, components & sub-systems. TDM can impose the same thermal
profiles & cycles on devices that will actually experience during the production
phase & during normal use. Throughout the thermal cycle, TDM measures the 3D
deformation related to the imposed thermal stress, thus revealing faults that would
likely occur during normal production & use.

For further information got to http://www.insidix.com/INSIDIX-Technologies.6.0.html