Developed to facilitate precision sectioning applications in Industry and Research, ULTRASLICE Precision Saw provides the user with a unique combination of features:
VERSATILE SAMPLE HOLDING
The system may be readily converted to handle sample cutting requirements of most shapes, sizes, and applications.
CUTTING ACCURACY & CONSISTENCY
Digital Selected Area Preparation System
ARC-lite is the world's first system to offer fast, reliable, room temperature AR coatings on package and wafer level devices. ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The sample produced are optimized and require no baking.
ARC-lite reaches maximum functionality when used with the ASAP-1 Selected Area Preparation System -- The ARC-lite sample mounting plate can be conveniently transferred between ARC-lite and ASAP-1.
Waferstudio is a visualization and data analysis software package that easily generates 3D views of wafers (wafer maps) and their related data nad provides powerful tools to work with this data.
The MX604 is an unique wafer characterisation system for solar- and semiconductor wafer.
The combination of capacitive and inductive sensors allow to measure tickness and resistivity at the same spot. The system is completely self calibrating, hence temperature and humidity variations are negligible.
The MX2012 is an automatic wafer geometry gauge to measure stress on 300 mm Si-wafers during Production. E+H’s technology using congtactless capacitive sensors is applied.
Throughput is 60 wafers/ hour
The MX2118 is a fully automated wafer geometry gauge.
A combination of two gauges offers the measurement of thickness, flatness, bow and warp
for 450 and 300 mm Si-Wafer
The MX203 is a manual loaded wafer geomtery gauge.
It measures the thickness, bow and warp of silicon wafer.
Stress option is available as well.
nTact’s proprietary slot die coating technology delivered in a small footprint, affordable platform geared to the R&D and pre-production market. The standard package is designed for the processing of 150 and/or 200mm square substrate sizes with a variety of optional features available for other applications.
The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most demanding MEMS and semiconductor process applications. Whether it’s for proper curing of multiple layers of polyimide in an RDL (Bond Pad Re-routing) application or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.