Resistivity Standards

• 76.2 mm, 200 mm, or 300 mm silicon wafers      
• Used with 4-Point Probes, Eddy Current Gauges

ITO Sheet Resistance Standards

• 125mm x 125mm x 0.7mm
• 90% In2O3:10% SnO2 plates

Silicon Dioxide Standards

• Uniform layer of silicon dioxide on silicon wafers
• Used with Ellipsometers, Reflectometers, Film Monitors

Silicon Nitride Standards

• Layer of Silicon Nitride (LPCVD) on silicon wafers
• Used with Ellipsometers, Reflectometers, Film Monitors

NanoCD Standards

• 25, 45, 70 and 110 nm Line Width
• Used with SEMs and CD-AFMs

Nanolattice Standard (NLS)

The NanoLattice Module Standard (NLSM) is a CD SEM calibration standard which enables accurate sub 0.13 μm lithography. The NanoLattice has the 0.1 μm pitch required for sub 0.13 μm SEM magnification calibration and characterization of non-linearity across the field of view.

Absolute Contamination Standards

• Substrate Deposited Polystyrene Latex Spheres
• For use with Scanning Surface Inspection Systems (SSIS)

Edge Contamination Standards

• Edges of Substrate Deposited Polystyrene Latex Spheres
• For use with Edge Contamination Detection Systems

Reticle Contamination Standards

• Spheres deposited on photomasks / test plates
• For use with reticle and pellicle inspection systems

Silica Contamination Standards

• Substrate Deposited highly spherical Silica Spheres

TDM is a patented Insidix technology that helps the engineers to increase reliability
of their products from complex packaging and allows Failure Analysis engineers to
understand the root causes of failure observed in operations. The TDM operating
system combines a powerful, internally developed heating/cooling sequence with a
sophisticated optical set up for 3D topography analysis under thermal stress of all
kinds of materials, components & sub-systems. TDM can impose the same thermal